SI Interconnect Co-op

Your Job

As an SI Interconnect Intern, you will work at the intersection of mechanical design and electrical performance.

You will support the development of next-generation interconnect solutions (such as USB-C, HFM, and HS-Max) by using advanced 3D electromagnetic (EM) simulation tools and high-frequency lab equipment.

Your goal is to ensure that Molex products maintain signal integrity across demanding automotive and data center environments.

Our Team

Molex CMS Networking team is a leader in Interconnect in providing connectivity solutions in Automotive industry in the area of high speed.

In this role, you aren't just placing components; you are designing the components that make modern technology possible.

You will gain exposure to:


* Automotive high-speed links (Self-driving car data backbones).


* Automotive Ethernet, Ser, Deser and other systems


* Complex Material Science (How different plastics and plating affect signals).

What You Will Do

3D EM Simulation & Modeling


* Full-Wave Modeling: Assist in creating high-fidelity 3D models of connectors and cable terminations using Ansys HFSS or CST Studio Suite.


* Virtual Prototyping: Run simulations to extract S-parameters and identify impedance discontinuities within the connector pin-field and mating interface.


* Optimization: Perform "what-if" analyses on mechanical variables (e.g., pin geometry, plastic dielectric constants, shield spacing) to optimize return loss and crosstalk.

Lab Validation & Characterization


* High-Frequency Measurement: Use Vector Network Analyzers (VNA) and Time Domain Reflectometers (TDR) to characterize physical prototypes up to 20 GHz or higher.


* Fixture De-embedding: Learn and apply de-embedding techniques (like AFR or TRL) to remove the effects of test boards, isolating the performance of the connector itself.


* Correlation: Compare lab measurement data against simulation models to validate accuracy and refine simulation methodologies.

Crosstalk Simulation & Discovery (Pre-Silicon/Pre-Layout)


* Aggressor-Victim Analysis: Use Ansys HFSS to perform "discovery" simulations identifying the most significant crosstalk contributors within a high-density pin array.


* NEXT/FEXT Modeling: Extract Near-End Crosstalk (NEXT) and Far-End Crosstalk (FEXT) S-parameters to determine the isolation levels between differential pairs.


* ICN Calculation: Calculate Integrated Crosstalk Noise (ICN) and Power Sum Crosstalk to evaluate total noise interference against IEEE 802.3 or OIF-CEI limit lines.


* Pin-Map Optimization: Based on crosstalk discovery, provide recommendations for optimized signal-to-ground ratios and pin-mapping (e.g., G-S-S-G patterns) to shield sensitive high-speed lines.

Crosstalk Validation (Lab/Post-Layout)


* Multi-Port Measurements: Utilize 4-port or 8-port Vector Network Analyzers (VNAs) to measure real-world crosstalk in physical prototypes and connector mating interfaces.


* Ti...