Principal High Speed Optoelectronic Design Lead

Your Job

Molex is seeking a Principal High-Speed Optoelectronic Design Lead to join our Optical Solutions Business Unit (OSBU).

In this role, the successful candidate will be part of a world-class engineering team, contributing to the development of next-generation Photonic Integrated Circuits (PICs).

The successful candidate will be responsible for designing, implementing, and validating advanced high-speed optoelectronic components for PICs, transceivers, and optical engines.

The Principal High-Speed Optoelectronic Design Lead will provide design support for existing and advanced photonic technology and collaborate with global, cross-functional teams and supplier partners to develop next-generation photonic solutions.

Our Team

The PIC Components and Technology Development team are responsible for the research and development of advanced technology platforms and solutions for the next generation of optical connectivity in AI fabrics, data centers, and datacom applications.

Reporting to the Director of Photonics Technology, you will be a key member of the team and will serve as the technical lead for developing advanced integrated RF interconnect technologies such as TSV and EPIC for 400G/L PAM4, CPO, and 1.6T/3.2T coherent products and will closely collaborate with the PIC component design, signal integrity, layout, test & reliability, and transceiver design teams as well as with external partners like semiconductor foundries, OSATs, CMs, and vendors.

This role can be based anywhere in the Unites States or Canada.

What You Will Do


* Lead the R&D, design, and EVT/DVT activities with regards to developing advanced integrated high-speed optoelectronic components for 400G/L PAM4, CPO, and 1.6T/3.2T coherent products.


* Closely collaborate with the SI/PI, opto-mechanics & packaging, and test & reliability teams to provide appropriate test vehicles for EVT/DVT of high-speed components.


* Work with external partners, foundries, CMs, and OSATs to develop required processes and demonstrate production level performance, reliability, and quality.


* Intimately collaborate with the SI/PI and transceiver design teams to build and validate predictive RF models for pluggables and transponders including external ASICs components such as DRV, TIA, DSP (LPO, LRO).


* Collaborate with the PIC component design & PDK teams in developing advanced modulator devices for the next generation of PIC products.


* Mentor other SI/PI engineers and cross functional groups on advanced EM simulation and design techniques based on commercial software tools and custom codes.

Who You Are (Basic Qualifications)


* PhD - or equivalent - typically in Electrical Engineering, Microwave Photonics, Physics or related technical fields


* At least 12 years of relevant industry experience in designing advanced RF interconnects and/or signal/power integrity for optical connectivity applications


* Strong knowledge of Si and/or III-V photonic i...