Lead Process Engineer, Wafering

Primary Duties & Responsibilities


* Control, optimize, and develop substrate slicing manufacturing processes.

Contribute to ideas, concepts, approaches, and engineering solutions.


* Focus on wafering technological processes with the goals of improving yields, throughput and meeting customer and business requirements.


* Ensure that each technological step is properly documented, reviewed, validated, approved and provides feedback to the R&D Center that will help improve manufacturing processes, improve yield and lower cost.


* Use statistical tools (SPC, DOE, etc.) to characterize the wafering processes to determine process capability and reliability while identifying bottlenecks.

Analyze process/product failure modes and provides feedback for process optimization.


* Adhere to project timelines and effectively communicates project progress and challenges.


* Provide technical and engineering support to the manufacturing team.

Instruct and train process operators and technicians.


* Establish the technological process steps of commercial substrate wafering.

Ensure that each operational process step is performed in accordance with our standard procedures.


* Perform process and equipment troubleshooting, problem identification, and corrective action activities.


* Assist with planning, scheduling, and resource allocation for all wafering related items.


* Participate in R&D Programs by organizing and carrying out project activities.

Adhere to the project timelines and milestones


* Summarize experimental results in formal or informal written and oral reports.

Participate in technology meetings by providing reports, plans, meeting minutes, action items and other requested documentation.


* Contribute to the work of the quality assurance team by providing expertise in process characterization.

Serve as a resource to the QA personnel with respect to the characterization techniques, equipment, and procedures.


* Actively participate in characterization of substrates.

Analyze the obtained characterization data to establish fundamental trends and correlations and to develop scientifically sound conclusions.

Use the results of characterization to establish factors that affect wafer quality and make recommendations for technology optimization.


* Communicate experimental and analytical results to the SiC substrate team in a timely manner to accelerate technological progression.

Education & Experience


* Bachelors degree with 7 years of related experience, MS with 5 years experience, or PhD with 3 years of experience in Mechanical Engineering, Materials' Science, Physics, Chemistry, or related STEM disciplines.


* Minimum of 3-7 years of hands-on experience with process control and development in an industrial manufacturing setting.

Experience requirements scale with degree relevance and level.

Substrate slicing and/or grinding experience preferred.


* Experience analyzing and interp...