Process Engineer, Dry Etch

Primary Duties & Responsibilities


* Lead the development and optimization of dry etch processes (ICP, RIE) for compound semiconductor applications.


* Drive process integration and improvement initiatives to enhance device performance and yield.


* Define and control etch process parameters for GaAs and InP substrates, ensuring precision, uniformity, and repeatability.


* Utilize advanced metrology tools such as SEM, AFM, ellipsometry, profilometry, XPS, XRD, and optical interferometry for process characterization and defect analysis.


* Work closely with integration, production, and device engineering teams to integrate etch processes into the overall semiconductor fabrication flow.


* Troubleshoot process deviations, particle contamination, and chamber performance issues, implementing corrective actions and continuous improvement strategies.


* Establish and maintain Statistical Process Control (SPC) for process monitoring and optimization.


* Evaluate and qualify new etch chemistries, hardware configurations, and process automation tools.


* Develop and document process recipes, work instructions, and standard operating procedures (SOPs).


* Mentor junior engineers and provide technical leadership in semiconductor dry etch and metrology.

Education & Experience


* Bachelor's, Master's, or Ph.D.

in Materials Science, Electrical Engineering, Physics, or related field.


* 5+ years of experience in semiconductor process engineering, specializing in dry etch (ICP, RIE).


* Strong background in etch chemistry, selectivity, anisotropy, and plasma physics for III-V semiconductor processing.


* Expertise in GaAs and InP processing, including device fabrication challenges and best practices.


* Hands-on experience with metrology tools such as SEM, AFM, ellipsometry, profilometry, and XPS for process verification and defect analysis.


* Strong problem-solving skills with experience in data analysis, SPC, and DOE (Design of Experiments).


* Ability to work in a cleanroom environment and interface with cross-functional engineering teams.

Skills


* Experience with high-volume semiconductor manufacturing or advanced R&D prototyping.


* Knowledge of metal etching, dielectric etching, and post-etch cleaning techniques.


* Familiarity with automation (SECS/GEM), scripting, or AI-driven process control, including FDC (Fault Detection and Classification) and APC (Advanced Process Control)


* Demonstrated leadership in technical project management and team mentoring.

Working Conditions


* Will be exposed to areas where hand tools and power tools are being operated


* Will be exposed to areas where hazardous chemicals or gases are stored


* Ability to work in a cleanroom environment per semi-conductor protocol/requirements

Physical Requirements


* Work in a class 100/1000 clean room for extended periods


* Wear full cleanroom attire (smock, mask, etc.)
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