Sr. Process Integration Engineer

Your Job

Molex possesses a rich heritage in the optical industry.

We provide the highest performing and field-proven wavelength management solutions from components, modules to integrated line-cards.

Our team is dedicated to continuous innovation in passive component function integration, miniaturization, and manufacturing automation.

We provide cutting edge technology with a comprehensive optical, mechanical, electrical and software integration capabilities enable us to serve the needs of high-density, high-bandwidth, and flexible optical networks.

We serve large, global clients in telecom and datacom industries in providing next generation optical modules to support the growing need for data and communications.

We are looking for a Product Integration Engineer to work with our 400Gbps / 800Gbps / 1.6Tbps opto-electronic products.

What You Will Do


* Improve system level performance of Molex 400Gbps / 800Gbps / 1.6Tbps opto-electronic products


* Scope and build experiments to quantify transceiver performance characteristics


* Design and contribute to automated bench-level testing


* Create linkage of manufacturing processes to system performance for Molex opto-electronic products


* Develop knowledge base of product sensitivities to aid product and process design for next generation products


* Guide continuous improvement opportunities while working with product design and manufacturing team


* Manage and interact with suppliers, subcontractors and contract manufactures


* Responsible for improving performance through monitoring process, parametric test and yield


* Perform necessary research to ensure Molex maintains alignment with latest industry standards (IEEE, MSA, IEC, etc.)

Who You Are (Basic Qualifications)


* Bachelor's Degree in Electrical Engineering


* 5+ years of relevant experience in opto-electronic or transceiver products in an NPI environment


* Understanding of analog and digital design


* Understanding of Digital Signal Processing (DSP)


* Experience with reliability of packages and the impact of packaging on device reliability


* Experience in active and passive optical alignment, adhesive processes, package sealing, fiber termination, etc.


* Experience with common packaging processes such as Die Attach, Wire bonding, adhesives, etc.


* Knowledge of statistical analysis methods (DOE, Gage R&R, etc.).


* Understanding of key aspects of IC packaging or packaging of optoelectronic devices


* Understanding of automating test systems


* Experience with FMEAs, root cause analysis, 8D, and Ishikawa's


* Experience at board level using common measurement equipment


* Experience with Python, C#, R or Matlab

For this role, we anticipate paying $100,000-$150,000 per year.

This role is eligible for variable pay, issued as a monetary bonus or in another form.

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