Field Application Engineer - Flexible Printed Circuits
Your Job
Molex brings together innovation and technology to deliver electronic solutions to customers worldwide.
With a presence in more than 40 countries, Molex offers a full suite of solutions and services for many markets, including data communications, consumer electronics, industrial, automotive, commercial vehicle and medical.
With today's devices trending toward smaller form factors and miniaturization, traditional printed circuit boards (PCBs) can be too rigid to accommodate evolving designs.
As a leading supplier of versatile printed circuit solutions, Molex empowers customers with innovations that are small, light, and extremely adaptable.
Our extensive offerings reflect a wide range of specialized substrates and technologies that help deliver excellent signal integrity, impedance control and thermal management-including PEDOT polymer, flexible silver and more.
We are seeking a Field Application Engineer for our Printed Circuit Solutions (PCS) group.
In this role you will develop solutions to solve customers' Flexible Printed Circuit design needs.
You'll provide technical guidance to customers and internal engineering teams on optimal materials, stackups, traces (spacing, width, routing), and other design requirements.
Some global responsibilities include leveraging knowledge of Molex Taiwan capabilities to drive solutions that are optimal for manufacturing.
This position may be remote.
What You Will Do
* Work with the customer to gather Voice of the Customer (VOC) and other critical design requirements.
* Review customer design inputs: Schematics, Pinouts, Signal Integrity and Power requirements and determine if the requirements are able to meet the customer's design objective.
Additionally, do the inputs meet Molex Taiwan's manufacturing capabilities.
* Provide design guidance to CAD resources on optimal layout for each customer design, review and approve CAD outputs.
* Provide manufacturing guidance to Molex Taiwan design and process engineering teams (as required) to insure NPI designs are manufactured correctly.
* Follow product development process, cooperate with cross functional team to support customer product design requirement.
* Perform signal integrity measurement or simulation to analyze and support external/ internal customers.
* Review costings from Molex Taiwan for accuracy before submitting to BDM for quoting.
Who You Are (Basic Qualifications)
* Bachelor's degree in Electrical Engineering
* 3 or more years of Signal and Power Integrity analysis or high-speed signal and power PCB/FPC design experience
* Experience laying out circuits with Allegro or Altium
* Experience with SI simulation software
* Ability to work with cross functional teams at customers and internally, with those teams spread out geographically around the world.
(primarily US, Asia, and Europe)
* Experience in creating and using FMEA's and performing DFM reviews.
* Knowled...
- Rate: Not Specified
- Location: Naperville, US-IL
- Type: Permanent
- Industry: Engineering
- Recruiter: Molex
- Contact: Not Specified
- Email: to view click here
- Reference: 163686-en_US-US-IL-NAPERVILLE
- Posted: 2024-11-18 07:13:45 -
- View all Jobs from Molex
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